Accelerated data processing in SSDs comprises SPAs an APM and host processor whereby the SPAs has multiple of SPEs

ABSTRACT

A system includes a plurality of storage processing accelerators (SPAs), at least one SPA of the plurality of SPAs including a plurality of programmable processors or storage processing engines (SPEs), the plurality of SPEs including n SPEs (n is a natural number greater than zero), where 1st to (n−1) SPEs of the n SPEs are configured to provide an output of the SPE to a next SPE of the n SPEs in a pipeline to be used as an input of the next SPE; and an acceleration platform manager (APM) connected to the plurality of the SPAs and the plurality of SPEs, and configured to control data processing in the plurality of SPAs and the plurality of SPEs.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/269,508, filed Feb. 6, 2019, which claims priority to and the benefitof U.S. Provisional Patent Application Ser. No. 62/775,745, filed Dec.5, 2018, the entire contents of both of which are incorporated herein byreference. The present application is further related to U.S. patentapplication Ser. No. 16/122,865, which claims priority to and thebenefit of U.S. Provisional Patent Application Ser. No. 62/638,904,filed Mar. 5, 2018; U.S. Provisional Patent Application Ser. No.62/641,267, filed Mar. 9, 2018; U.S. Provisional Patent Application Ser.No. 62/642,568, filed Mar. 13, 2018; U.S. Provisional Patent ApplicationSer. No. 62/722,656, filed Aug. 24, 2018, the entire content of each ofwhich is incorporated by reference herein for all purposes.

FIELD

One or more aspects of embodiments according to the present inventionrelate to system and method for accelerated data processing in solidstate drives (SSDs).

BACKGROUND

Moving raw data to central processing unit (CPU) for processing andanalyzing is expensive in terms of amount of energy consumed. It alsoincreases the burden on resources such as network bandwidth, CPU cycles,and CPU memory. These added resource requirements result in high capexand opex spending. Hence, processing raw data within the storage device(e.g., SSD) is a cost effective solution for data analysis use casesthat are needed for monetization of the growing amount of raw data.

The above information in the Background section is only for enhancementof understanding of the background of the technology and therefore itshould not be construed as admission of existence or relevancy of theprior art.

SUMMARY

This summary is provided to introduce a selection of features andconcepts of embodiments of the present disclosure that are furtherdescribed below in the detailed description. This summary is notintended to identify key or essential features of the claimed subjectmatter, nor is it intended to be used in limiting the scope of theclaimed subject matter. One or more of the described features may becombined with one or more other described features to provide a workabledevice.

Aspects of example embodiments of the present disclosure relate tosystem and method for accelerated data processing in SSDs.

In some embodiments, a method for offloading and acceleration ofapplication functions from a host device to a storage device methodincludes: receiving, at an acceleration platform manager (APM) from anapplication service manager (ASM), application function processinginformation; allocating, by the APM, a first storage processingaccelerator (SPA) from a plurality of SPAs, wherein at least one SPA ofthe plurality of SPAs includes a plurality of programmable processors orstorage processing engines (SPEs), the plurality of SPEs including nSPEs (n is a natural number greater than zero), downloading, by the APM,a micro-code into at least one SPE of the plurality of SPEs in the firstSPA, and enabling the plurality of SPEs in the first SPA, wherein onceenabled, the at least one SPE of the plurality of SPEs in the first SPAis configured to process data based on the application functionprocessing information; determining, by the APM, if data processing iscompleted by the at least one SPE of the plurality of SPEs in the firstSPA; and sending, by the APM, based on determining that the dataprocessing is completed by the at least one SPE of the plurality of SPEsin the first SPA, a result of the data processing by the SPEs of thefirst SPA, to the ASM.

In some embodiments, the method further includes extracting, by the APM,data based on the application function processing information;programming, by the APM, one or more arguments received from the ASM inthe at least one SPE of the plurality of SPEs in the first SPA; andcreating and programming, by the APM, one or more data movementdescriptors. The method also includes intercepting, at a host processor,at least one application function call; gathering, at the hostprocessor, the application function processing information including oneor more of source of data for processing the application function call,type of processing of the application function call, arguments for theapplication function call, and destination of results after the data isprocessed; and receiving, at the ASM in a host device software stack,the application function processing information, wherein based onreceiving the application function processing information, the ASM isconfigured to: select a processor including the APM for applicationfunction processing; schedule the data processing in the processor;initiate data transfer direct memory access (DMA) engines to loadappropriate data into one or more buffers of the processor; and send aninvocation trigger and the application function processing informationto the processor.

In some embodiments, the at least one SPA of the plurality of SPAsincludes an input buffer or an input staging random-access memory(ISRAM) and an output buffer or an output staging RAM (OSRAM). In someembodiments, the at least one SPE includes an input data buffer (IDB),wherein the at least one SPE is configured to write an output of the atleast one SPE into the IDB of the next SPE of the plurality of SPEs in apipeline. In some embodiments, the IDB is shared between two neighboringSPEs of the plurality of SPEs. In some embodiments, the micro-coderunning on the at least one. SPE of the n SPEs is configured toprogrammatically generate start of batch and end-of-batch indications tothe next SPE of the n SPEs in the pipeline for batch oriented pipelineddata processing. In some embodiments, the data is extracted from one ormore solid state drives (SSDs) connected to a processor including theAPM.

In some embodiments, 1st to (n−1) SPEs of then SPEs are configured toprovide an output of the SPE to a next SPE of the n SPEs in a pipelineto be used as an input of the next SPE. In some embodiments, the APM isconfigured to access one or more of instruction RAM (IRAM) and data RAM(DRAM) via the at least one SPE of the plurality of SPEs. In someembodiments, the at least one SPE includes a first bus for the IRAM anda second bus for the DRAM. In some embodiments, the DRAM includesscratch pad, input data buffer (IDB), output data buffer (ODB), argumentRAM (ARAM), and miscellaneous RAM (MRAM), wherein one or moreprogrammatic SPE features are configured to be based on the MRAM andprogrammatically accessed by the micro-code running on the at least oneSPE as pointers. In some embodiments, an input data buffer (IDB) dataavailable and space available status are generated using IDB readpointer of a first SPE of the n SPEs in a pipeline and an output databuffer (ODB) write pointer of a second SPE previous to the first SPE ofthe n SPEs in the pipeline to share the IDB in an arbitrary granularitywithout any overflow or underflow. In some embodiments, the plurality ofSPAs is configured to run in parallel on different slices of datareceived from the ASM.

In some embodiments, a method includes receiving, by a processor,application function processing information; allocating, by theprocessor, a first storage processing accelerator (SPA) from a pluralityof SPAs in the processor, wherein at least one SPA of the plurality ofSPAs includes a plurality of programmable processors or storageprocessing engines (SPEs), the plurality of SPEs including n SPEs (n isa natural number greater than zero); enabling, by the processor, theplurality of SPEs in the first SPA to execute a data processingoperation based on the application function processing information; anddetermining, by the processor, that the data processing operation iscompleted by at least one SPE of the plurality of SPEs in the first SPA.

In some embodiments, 1st to (n−1) SPEs of then SPEs are configured toprovide an output of the SPE to a next SPE of the n SPEs in a pipelineto be used as an input of the next SPE, and wherein the applicationfunction professing information and an invocation trigger are receivedat an acceleration platform manager (APM) in the processor from anapplication service manager (ASM).

In some embodiments, the method further includes downloading, by theprocessor, a micro-code into the at least one SPE of the plurality ofSPEs in the first SPA; programming, by the processor, one or morearguments in the at least one SPE of the plurality of SPEs in the firstSPA; creating and programming, by the processor, one or more datamovement descriptors; extracting, by the processor, data based on theapplication function processing information, wherein the data isextracted from one or more solid state drives (SSDs) connected to theprocessor; sending, by the processor, based on determining that the dataprocessing is completed by the at least one SPE of the plurality of SPEsin the first SPA, a result of the data processing by the SPEs of thefirst SPA, to the ASM; and resetting or disabling, by the processor, thefirst SPA.

In some embodiments, the method further includes intercepting, at a hostprocessor, at least one application function call; gathering, at thehost processor, application function processing information includingone or more of source of data for processing the application function,type of processing, arguments for the application function call, anddestination of results; and receiving, at the ASM in a host devicesoftware stack, the application function processing information, whereinbased on receiving the application function processing information, theASM is configured to: select the processor for application functionprocessing; schedule data processing in the processor; initiate datatransfer direct memory access (DMA) engines to load appropriate datainto one or more processor buffers; and send the invocation trigger andthe application function processing information to the processor.

In some embodiments, the at least one SPA of the plurality of SPAsincludes an input buffer or an input staging random-access memory(ISRAM) and an output buffer or output staging RAM (OSRAM), the at leastone SPE includes an input data buffer (IDB), wherein the at least oneSPE is configured to write an output of the at least one SPE into theIDB of the next SPE of the plurality of SPEs in a pipeline.

In some embodiments, a method for offloading and acceleration ofapplication functions from a host device to a storage device includes:receiving, at a processor, from a controller, application functionprocessing information; selecting, by the processor, a first storageprocessing accelerators (SPAs) from a plurality of SPAs in theprocessor, wherein at least one SPA of the plurality of SPAs includes aplurality of programmable processors or storage processing engines(SPEs)), the plurality of SPEs including n SPEs (n is a natural numbergreater than zero); transmitting a signal to at least one SPE of theplurality of SPEs of the first SPA to execute a data processingoperation according to the application function processing information;determining, by the processor, that the data processing operation iscompleted by the at least one SPE of the plurality of SPEs in the firstSPA; and sending, by the processor, a result of the data processingoperation to the controller.

In some embodiments, 1st to (n−1) SPEs of then SPEs are configured toprovide an output of the SPE to a next SPE of the n SPEs in a pipelineto be used as an input of the next SPE, and wherein the applicationfunction processing information including one or more of source of datafor processing the application function call, type of processing ofapplication function call, arguments for the application function call,and destination of results after the data is processed.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of some example embodiments of the presentinvention will be appreciated and understood with reference to thespecification, claims, and appended drawings, wherein:

FIG. 1 illustrates a block diagram representation of various componentsof a storage acceleration system;

FIGS. 2A-2B illustrate the details of a storage acceleration hardwareplatform device.

FIG. 3 illustrates a detailed architecture of a storage processingaccelerator (SPA);

FIG. 4A illustrates a SPA using a non-volatile memory (NVM) express(NVMe) or NVMe over fabric (NVMe-oF) hardware data path of a bridgedevice;

FIG. 4B illustrates a high level architecture of a connected fabric;

FIG. 5A illustrates a block diagram of a SPA architecture;

FIG. 5B illustrates a block diagram of a processor access module (PAM).

FIG. 5C illustrates a block diagram of a system memory access module(SAM);

FIG. 5D is a block diagram illustrating details of a storage processingengine (SPE) slice.

FIGS. 5E-5F illustrate memory hierarchy for two SPE stages and datasharing between the two SPE stages;

FIG. 6 is a block diagram illustrating a high level operation of anacceleration platform manager (APM);

FIG. 7 is a flow chart illustrating a method of SPA initialization;

FIG. 8 is a flow chart illustrating a method of SPA runtime operation;and

FIG. 9 illustrates a graph.

DETAILED DESCRIPTION

The detailed description set forth below in connection with the appendeddrawings is intended as a description of some example embodiments ofsystem and method for accelerated data processing in SSDs provided inaccordance with the present invention and is not intended to representthe only forms in which the present invention may be constructed orutilized. The description sets forth the features of the presentinvention in connection with the illustrated embodiments. It is to beunderstood, however, that the same or equivalent functions andstructures may be accomplished by different embodiments that are alsointended to be encompassed within the scope of the invention. As denotedelsewhere herein, like element numbers are intended to indicate likeelements or features.

Moving raw data to central processing unit (CPU) for processing andanalyzing is expensive in terms of amount of energy consumed. It alsoincreases the burden on resources such as network bandwidth, CPU cycles,and CPU memory. These added resource requirements result in high capitalexpense (capex) and operational expense (opex) spending. Hence,processing raw data within the storage device (e.g., SSD) is a costeffective solution for data analysis use cases that are needed formonetization of the growing amount of raw data. Moreover, data analyticstasks often read a large amount of data, process it, and reduce itthrough filtering and other reduction operations. These tasks are aperfect fit for in-SSD acceleration, as they (1) take advantage of thehigher available bandwidth within the device, and (2) preserve thelimited bandwidth between the SSD and the CPU (i.e. a peripheralcomponent interconnect express (PCIe) interface) by only moving thereduced results.

Example embodiments of the present disclosure describe a fieldprogrammable gate array (FPGA)-based hardware platform for complexapplication acceleration use cases. However, the SPA can be implementedinside SSD controller (e.g., 108 of FIG. 1) device, or NVMe/NVMe-oFbridge device or a SSD controller co-processor device. The SSDcontroller or NVMe/NVMe-oF devices can be implemented using FPGA orapplication-specific integrated circuit (ASIC). A SSD controllerco-processor device can be implemented using FPGA or ASIC.

Instead of designing single or specific application-specificacceleration hardware, the example embodiments of the present disclosureprovide a more general field programmable gate array (FPGA) architecturethat may cater to a larger set of applications. The FPGA architecturecontains simple programmable processors (named SPEs), arranged in ahandful of clusters (e.g., storage processing accelerators (SPAs)),where every cluster (e.g., SPA) contains a group of processors coupledand pipelined together. Incorporating programmable processor in the FPGAarchitecture increases the flexibility of the architecture, greatlyreduces the programming effort, and allows the same design to cater tolarger set of applications. For example, the same FPGA architecture maybe used to accelerate processing of different file formats (e.g.,parquet, orc, etc.) with the designs differing only in the microcoderunning on the in-FPGA programmable processor. Moreover, smallaccelerators can be added for specific tasks (i.e., snappy decompressionfor parquet) and may be incorporated into the clustered design.

SPA architecture design follows specific objectives and goals. The firstgoal is to offload data processing in or near storage, freeing CPUcycles and improving performance. Second objective is to reduce datamovement by performing reduction operations such as filter, limit, join,aggregation, or the like, on large datasets closer to data storage.Offloading such operations, in addition to providing relief on CPU, cansignificantly reduce the size of the data read by the host, leading toreduced storage, memory and network bandwidth requirements as well asreduced system power. Lastly, SPA architecture should provideflexibility and ease of programming to allow for short development andtime to market.

The SPA architecture is envisioned to be used for a variety of complexhigh level use cases such as Parquet SSD, database applications, or thelike. Such use cases may involve the following types of data processing:

1) query processing, including filter, limit, join and aggregation;

2) text processing, including format conversions, parsing, filtering,sorting and interpretations;

3) arithmetic computations, formulate calculations; and

4) regular expressions such as data transformations and pattern search.

In order for the SPA architecture to enable application acceleration usecases, it should have enough computing power to be able to handlecomplex data processing of wide variety of data formats (relationaldatabase, parquet, orc, etc.) or even unknown data formats. Thisprocessing should be done at speeds close to hardware rates, so it doesnot become performance bottleneck of the system and should remain withinset power constraints. As data and analytics ecosystem is growingrapidly, new use cases for data storage applications come up frequently.The SPA should be flexible enough to support new future use cases orenhancements of existing use cases easily and efficiently. Lastly, it isimportant that the SPA architecture is cost effective and allows higheracceleration performance at lower cost.

FIG. 1 illustrates a block diagram representation of various componentsof a storage acceleration system 100.

In the storage acceleration system 100, the application service manager(ASM) 102 (e.g., a controller, central processing unit, host processor,or the like) provides acceleration orchestration support from hostsoftware stack (e.g., application stack, storage stack, non-volatilememory (NVM) express (NVMe) driver). The acceleration platform manager(APM) 104 firmware, running on the embedded processor, provides theacceleration orchestration support from the device side. ASM and APMtogether facilitate offloading of various acceleration functions,acceleration kernels, and runtime operation onto the SPAs. The hardwareplatform (e.g., FPGA) may contain multiple instances of SPA. There aredifferent flavors and types of SPA that can be used in a given hardwareplatform.

FIGS. 2A-2B illustrate the details of a storage acceleration hardwareplatform device. In the device of FIGS. 2A-2B, high data processingperformance is achieved through pipelined processing within the SPA(e.g., SPA 202(1) as shown in FIG. 2A), and parallel and pipelinedprocessing across multiple SPAs (e.g., 202(1), 202(2), . . . , 202(n),as shown in FIG. 2B), as multiple SPAs are connected to each other inparallel via a system bus (e.g., 308 of FIG. 3) and the multiple SPEs ineach SPA are chained together to enable pipelined data processing andtransformation. SPAs (e.g., 202(1), 202(2), . . . , 202(n)) are highlycustomizable, supporting parameterized hardware resources and may beprogrammed to provide different functionality. With high level ofparallelism in data as is the case for most data intensive applications,SPAs can perform the same function on different data streams inparallel. If more computing power is needed, SPAs with different flavormay be chained providing more pipelined processing. Acceleration storagedevice of FIGS. 2A-2B, workflow is efficiently managed by the embeddedorchestrator CPU 201.

FIG. 3 illustrates a detailed architecture of a SPA 302. The SPA 302 maybe any one of the SPAs 202(1), 202(2), . . . , 202(n), as shown in FIG.2B. SPA 302 is a pipelined data processing architecture that enablesefficient processing of very large datasets. Each SPA (e.g., SPA 302)includes one or more storage processing engines (SPEs) (e.g., 304(1),304(2), . . . , 304(n)) that are chained together to enable pipelineddata processing and transformation.

There are various flavors of SPEs. Hence the SPE interfaces andprogramming model are architected to be a template. Different lightweight cores as well as micro-code engines can be used to create a SPE.It is also possible to have different SPE flavors to co-exist in asingle SPA as well as across multiple SPAs. The following flavors ofSPEs are currently under consideration: 1) MicroBlaze based; 2)lightweight CPU core such as reduced instruction set computer (RISC)-Vbased, and 3) micro code engines (MCE) or Micro Sequencer using custominstruction set architecture based.

Each SPE (e.g., 304(1), 304(2), . . . , 304(n)) has a dedicated inputbuffer (e.g., 312(1), 312(2), . . . , 312(n)), and an output interface.An SPE (e.g., 304(1), 304(2), . . . , 304(n)) can write the outputs orintermediate results into the input buffer (e.g., 312(1), 312(2), . . ., 312(n)) of the next SPE (e.g., 304(1), 304(2), . . . , 304(n)).Different configurations of SPA (e.g., 302) may contain different amountof hardware resources. Namely, a different number of SPEs (e.g., 304(1),304(2), . . . , 304(n)) can be provisioned to different SPA (e.g., 302)configurations according to the specific function the SPA (e.g., 302)targets. The SPE (e.g., 304(1), 304(2), . . . , 304(n)) outputs aremultiplexed (e.g., at the multiplexer 306) into the output buffer thatis present on the system bus 308. Each SPA (e.g., 302) also contains aninput buffer 316 (e.g., input staging random-access memory (ISRAM)) thatis accessible on the system bus 308. The basic data flow to or from eachSPA (e.g., 302) is such that an external direct memory access (DMA)engine (e.g., 206 of FIG. 2B) transfers data into the SPA input buffer316 (e.g., ISRAM). Then, the SPEs (e.g., 304(1), 304(2), . . . , 304(n))in that SPA (e.g., 302) perform a series of data processing,transformation steps, and finally the results are placed in the outputbuffer 318 (e.g., output staging RAM (OSRAM)). At that point, a DMAengine (e.g., 206 of FIG. 2B) may transfer out the results into a memorybuffer (310) outside the SPA. It may be possible for a DMA engine (e.g.,206 of FIG. 2B) to move data from the output buffer 318 (e.g., OSRAM) ofa SPA (e.g., 202(1)) into an input buffer 316 (e.g., ISRAM) of anotherSPA (e.g., 202(2)). Hence, the SPA architecture enables pipelining ofmultiple SPAs (e.g., 202(1), 202(2), . . . , 202(n), as shown in FIG.2B) if necessary for certain applications. Usually SPAs (e.g., 202(1),202(2), . . . , 202(n), as shown in FIG. 2B) are configured to run inparallel on different slices of the data. All the SPEs (e.g., 304(1),304(2), . . . , 304(n)) in a SPA (e.g., 302) can be configured throughconfiguration module 314 that is accessible to the embedded processor.The APM firmware running on the embedded processor performs SPA and SPEmanagement. The firmware loads appropriate micro-code into the SPEs(e.g., 304(1), 304(2), . . . , 304(n)) as necessary.

Each SPA (e.g., 302) also contains a system memory access module (SAM)312 that provides double data rate (DDR) memory access to the SPEs(e.g., 304(1), 304(2), 304(n)) if desired.

Processing data near or inside a storage device (e.g., FPGA+SSD)provides lower response latencies to the applications. It also savessignificant amount of energy that is needed to move large datasets tothe processor (e.g., host processor). Additionally, it enablesdistributed computing or in other words offloading and acceleration ofcertain application functions. The application functions that dependupon a large number of data movements to the host processor from thestorage system (e.g., FPGA+SSD) may benefit the most. Offloading suchapplication functions to a storage device (e.g., FPGA+SSD) minimizescomputing resources needed, and hence lowers cost of the informationtechnology (IT) infrastructure including compute cycles, memory, networkbandwidth, and energy consumed.

The application functions selected for storage offload and accelerationare first intercepted on the host. There are multiple ways and pointswhere such interception can be done. Once an application function callis intercepted, relevant information needed to process that call isgathered. Normally such information contains the source of data, type ofprocessing, and destination of the results.

Once such application function call processing information is gathered,it is passed to a host side software layer (e.g., application stack,storage stack, NVMe driver, as shown in FIG. 1) that would manage theoffloading and acceleration process. This host software layer is awareof the acceleration capabilities that are present and available, methodto interact with the acceleration platform, as well as the ways to trackrun-time status of offloaded functions. As ASM (e.g., ASM 102 of FIG. 1)receives the application offload processing information, it selectsacceleration platform to use and schedules the processing. It initiatesdata transfer DMAs (e.g., 206 of FIG. 2B) needed to load the appropriatedata into the acceleration platform buffers. It then sends theacceleration invocation trigger and information to the accelerationplatform. The APM (e.g., APM 104 of FIG. 1) is the peer of ASM presenton the acceleration platform and responds to ASM communication. Thecommunication between the ASM (e.g., ASM 102 of FIG. 1) and the APM(e.g., APM 104 of FIG. 1) can be implemented in many different ways.

The APM (e.g., APM 104 of FIG. 1) firmware running on the accelerationplatform provides a set of services that are used by the storage device(e.g., SSD) side application function. The storage device (e.g., SSD) orplatform side application firmware has primarily two areas of operation:a) initialization of acceleration engines i.e. SPAs (e.g., 202(1),202(2), . . . , 202(n), as shown in FIG. 2B) and b) run-timeconfiguration and monitoring of the SPAs (e.g., 202(1), 202(2), . . . ,202(n), as shown in FIG. 2B). The application firmware uses the APM(e.g., APM 104 of FIG. 1) services to implement and manage itsacceleration functionality on the platform.

During initialization phase, application firmware gets appropriate SPAs(e.g., 202(1), 202(2), . . . , 202(n), as shown in FIG. 2B) allocatedfor its usage. Once it gets the handle(s) of SPA (e.g., 302 as shown inFIG. 3), it loads appropriate micro-code into the SPEs (e.g., 304(1),304(2), . . . , 304(n)) of the SPA (e.g., 302 as shown in FIG. 3). Italso configures the other features of SPAs (e.g., 302 as shown in FIG.3) as necessary.

During run time, when the offloaded application is invoked by the hostsoftware, it receives relevant parameters related to the function call.More specifically the device side application receives informationregarding source of the data to be processed, arguments for the call,and destination of the results. The application firmware (e.g., usingAPM, e.g., APM 104 of FIG. 1) programs any necessary arguments into theSPEs (e.g., 304(1), 304(2), . . . , 304(n)) of the SPA (e.g., 302 asshown in FIG. 3). It sends the input data and result DMA (e.g., 206 ofFIG. 2B) instructions to the APM (e.g., APM 104 of FIG. 1). As mentionedearlier, ASM (e.g., ASM 102 of FIG. 1) delivers input data into thestorage device buffers. These buffers are called an input stagingrandom-access memory (ISRAM) (e.g., 508, as shown in FIG. 5A).Application firmware writes DMA descriptors to appropriate DMA channelsin the buffer manager (e.g., 406, as shown in FIG. 4A). The DMAdescriptor provides information regarding moving data received from aSSD controller into the appropriate SPA input buffers called as ISRAM(e.g., 316 of FIG. 3). The application firmware also programs anotherDMA channel to move the SPA processing results from OSRAM (e.g., 318 ofFIG. 3) memory to storage device buffers. Once the DMAs (e.g., 206 ofFIG. 2B) are programmed, the application firmware takes the SPEs (e.g.,304(1), 304(2), . . . , 304(n)) out of reset. At that point SPEs (e.g.,304(1), 304(2), . . . , 304(n)) start processing the requested data andproduce intended results. Once the processing is finished, applicationfirmware (e.g., using APM, e.g., APM 104 of FIG. 1) sends the resultsback to the host side application component.

The first SPE (e.g., SPE 304(1)) in the SPA (e.g., spa 302) selected forprocessing, keeps monitoring arrival of input data. Once sufficientinput data is detected in the input data buffer (IDB) (e.g., 312(1)),the first SPE (e.g., 304(1)) starts processing. It reads the data fromIDB (e.g., 312(1)), processes it and then writes appropriateintermediate results into the IDB ((e.g., 312(2)) of the next stage(e.g., 304(2). Once a batch of data is completely processed by the firstSPE (e.g., SPE 304(1)), it sends a trigger to the second SPE (e.g.,304(2)). At that point the second SPE (e.g., 304(2)) starts processingdata in its IDB (e.g., 312(2)). And the process follows with subsequentSPEs (e.g., 304(3), . . . , 304(n)).

When all the requested data is processed by a SPE (e.g., 304(1)), itsets the “done” status. Application firmware monitors all the SPEs(e.g., 304(1), 304(2), . . . , 304(n)) for completion of the processing.Once the results are available and moved out of the SPA (e.g., 302),application firmware may disable the SPA (e.g., 302).

FIG. 4A illustrates a SPA using a non-volatile memory (NVM) express(NVMe) or NVMe over fabric (NVMe-oF) hardware data path of a bridgedevice. In some embodiments, it may be possible for the NVMe/NVMe-oFhardware data path to use a three port switch or bridge logic. Otherpossible SPA implementations may be 1) integrated within SSD Controller,2) SSD Controller Co-processor devices using FPGA, or ASIC 3)NVMe-to-NVMe or NVMe-oF-to-NVMe bridge.

In the SPA implementation of FIG. 4A, the SPA sub-system 402 may includeSPAs 404(1), . . . , 404(n), which may be the SPAs 202(1), 202(2), . . ., 202(n), as shown in FIG. 2B.

The buffer manager (BM) module 406 in the SPA sub-system 402 implementsa set of on-chip buffers for receiving data from the SSD controller(e.g., 204 of FIGS. 2A-2B). The buffer manager module 406 maintains theset of on-chip buffers backed up with a larger set of buffers inexternal dynamic random-access memory (DRAM) 414. The buffer managermodule 406 receives data from SSD controller (e.g., 204 of FIGS. 2A-2B)and store in a free on-chip buffer, accesses the external DRAM (414)through an interface 412 (e.g., Advanced Extensible Interface (AXI)master interface) in case of on-chip buffer overflows, utilizes DMAchannels for moving data to/from SPA sub-system 402 to ISRAM or OSRAM,utilizes processor access module (PAM) interface for receiving DMAdescriptors and other configurations. The buffer manager module 406 alsoreceives data from NVMe/NVMe-oF hardware data path 408 and stores thatdata either in on-chip or off-chip buffers. In some embodiments, buffermanager module 406 may utilize on-chip buffers as cache and providebuffer management, allocation, deallocation, or the like. The buffermanager module 406 may also provide interface to DRAM for overflowbuffers and provide interface to PAM (e.g., 512 of FIG. 5A) forconfiguration, and interface to the SSD controller (e.g., 204 of FIGS.2A-2B) for data transfer, directly or through an on-chip switch

At any given time there can be multiple descriptors active oroutstanding.

The following table (Table 2) provides the description of the descriptorfields.

TABLE 2 Field Size (bits) Description DSCPTR-ID 16 DMA DescriptorIdentifier. Max 64K outstanding descriptors Type 8 0: Reserved 1: DRAMto SPA 2: SPA to DRAM 3: SPA to SPA 4: DRAM to DRAM Length 32 Transferlength in bytes, Max length 4 GB-1. Src 64 Source Address. Based onType, it can be Address DRAM address or SPA-ID Dest 64 DestinationAddress. Based on Type, it can be Address DRAM address or SPA-ID

The buffer manager 406 provides a completion status for each DMAdescriptor. The completion status includes the corresponding descriptorID so that APM (e.g., APM 104 of FIG. 1) firmware can tie it back to thedescriptor request.

The following format (Table 4) is one example used for DMA descriptorcompletion status.

TABLE 4 Field Size (bits) Description DSCPTR-ID 16 DMA DescriptorIdentifier. Max 64K outstanding descriptors Status 8 0: Successfulexecution 1: Error during execution

FIG. 4B illustrates a high level architecture of the connected fabric410 of FIG. 4A. The connected fabric module 410 implements data movementor connectivity between a set of SPAs, a set of special SPAs such snappydecompressor, and buffer manager (406) or DMA engine. There are threefunctions that the connected fabric module 410 performs to enable smoothdata movements: 1) provide data available or space available status tobuffer manager (406) or DMA engine, 2) provide interface for buffermanager (406) or DMA engine to write data into the SPAs 404(1), . . . ,404(n), or provide data-in interface, and 3) provide interface forbuffer manager (406) or DMA engine to read data from the SPAs 404(1), .. . , 404(n), or provide data-out interface.

The following table (Table 5) lists the signals of the interfacesdescribed above.

TABLE 5 Signal Width Polarity Comment 1. Data/Space Available data_ave32 Per SPA, number of bytes available in OSRAM space_ave 32 Per SPA,number of words of space available in ISRAM 2. Data-in data_in 64 Writedata from BM/DE to SPA data_in_valid# Active Per SPA ID, Highdata_in_last Active high 3. Data-out data_out_req# Active From BM/DE toSPA, per SPA ID high data_out_size 32 number of bytes data_out 64 Fromaddressed SPA to BM/DE data_out_valid Active high data_out_last Activehigh

The NVMe/NVMe-oF hardware data path module 408 implements NVMepass-through path for a host to interact with SSD controller (e.g., 204of FIGS. 2A-2B). A host performs data write and read operation throughthe NVMe/NVMe-oF hardware data path module 408. The NVMe/NVMe-oFhardware data path module 408 also supports an interface for capturingpeer-to-peer data from SSD controller (e.g., 204 of FIGS. 2A-2B) forfurther processing using SPA (e.g., 202(1) of FIG. 2A or 404(1), . . . ,404(n) of FIG. 4A). The NVMe/NVMe-oF hardware data path module 408implements an address range filter functionality. The programmed addressrange is used by the host to fetch data from SSD controller (e.g., 204of FIGS. 2A-2B) for processing by SPA (e.g., 202(1) of FIG. 2A or404(1), . . . , 404(n) of FIG. 4A). It is also possible for a host tostore the SPA (e.g., 202(1), 202(2), . . . , 202(n) of FIG. 2A or404(1), . . . , 404(n) of FIG. 4A) results back to the SSD controller(e.g., 204 of FIGS. 2A-2B). For that functionality, a host would sendNVMe write commands with source address falling in the filter addressrange programmed in the NVMe/NVMe-oF hardware data path module 408.

Each SPA of SPAs 404(1), . . . , 404(n), as shown in FIGS. 4A-4B, hasits own address map. There basically two distinct sets of registers: a)global to SPA b) SPE specific. Depending upon number of SPEs present inthe SPA, SPE registers have that many copies. In addition to the globalconfiguration, status registers, SPA address map also contains datastaging RAMS, ISRAM, and OSRAM. Following table (Table 6) illustratesone example address map and its contents of each SPA.

TABLE 6 offset-32-bit Reg # R/W Name Comment 0x0000_0000 0 RO Version0x0000_0008 1 RO DBG Debug 0x0000_0018 3 RO Status 0x0000_0020 4 RWControl 0x0000_0028 5 RW RESET_SPE Active low, bit mask, per SPE0x0000_0030 6 RO BUSY_SPE Active high, bit mask, per SPE 0x0000_0038 7RO DONE_SPE Active high, bit mask, per SPE 0x0000_0040 8 RO TB_AVE_SPETrace Buffer available, bit mask, per SPE 0x0000_0048 9 ROSPA_ISRAM_SPACE_AVE # of words, debug purpose 0x0000_0050 10 ROSPA_OSRAM_DATA_AVE # of words, debug purpose 0x0000_0058 11 RODMEM_ERROR Data memory addressing error, out-of-range address detected0x0010_0000 RW SPE0_IRAM Instruction memory 0x0020_0000 RW SPE0_SP Datamemory 0x0030_0000 RW SPE0_ARAM Argument memory 0x0040_0000 RO SPE0_TBTrace buffer 0x0040_0008 RO SPE0_IDB_DATA_AVE # of words 0x0040_0010 ROSPE0_ODB_SPACE_AVE Next IDB, # of words 0x0110_0000 RW SPE1_IRAMInstruction memory 0x0120_0000 RW SPE1_SP Data memory 0x0130_0000 RWSPE1_ARAM Argument memory 0x0140_0000 RO SPE1_TB Trace buffer0x0140_0008 RO SPE1_IDB_DATA_AVE # of words 0x0140_0010 ROSPE1_ODB_SPACE_AVE Next IDB, # of words 0x0210_0000 RW SPE2_IRAMInstruction memory 0x0220_0000 RW SPE2_SP Data memory 0x0230_0000 RWSPE2_ARAM Argument memory 0x0240_0000 RO SPE2_TB Trace buffer0x0240_0008 RO SPE2_IDB_DATA_AVE # of words 0x0240_0010 ROSPE2_ODB_SPACE_AVE Next IDB, # of words

FIG. 5A illustrates a block diagram of a SPA architecture 500. The SPA500 includes a set of SPE slices 504(0) and 504(1), an ISRAM 508, anOSRAM 510, a PAM 512, and a SAM 514.

As shown in FIG. 5A, the SPEs or SPE slices 504(0), 504(1) are chainedtogether to enable pipelined data processing and transformation. Therecan be N number of SPE slices in a given SPA design. Depending on theapplication, all the SPE slices may not be used. The SPE (e.g., SPEslices 504(0), 504(1)) outputs are multiplexed (e.g., at the multiplexer506) into the output buffer or OSRAM 510 that is present on the systembus. The multiplexer 506 may select the SPE slices for data processing.The multiplexor 506 may select output from the last SPE slice (e.g., SPEslices 504(0), 504(1)) based on instructions received from the firmware(e.g., APM) running on the embedded processor, as APM performs SPEmanagement. For example, the multiplexer 506 selects the last slice ofthe pipeline. All the slices of a SPA may not be used for the givenapplication, hence selection of the last slice for outputting.

ISRAM 508 is used by the buffer manager (e.g., buffer manager 406) todeposit data for processing by SPA 500. The data is fetched from the SSDcontroller and is delivered into the specified SPA 500 (or 404(1)) bythe buffer manager (e.g., buffer manager 406). The amount of free spaceavailable in the ISRAM 508 is indicated in a SPA 500 register. That freespace information is used by the buffer manager (e.g., buffer manager406) for flow control purposes.

OSRAM 510 is used by the buffer manager (e.g., buffer manager 406) tomove SPA 500 processing results to its destination either in an on-chipbuffer or in an external DRAM (e.g., 410). The amount of data availablefor moving out is indicated in a SPA register.

PAM 512 provides SPA configuration access to the firmware running on theembedded processor. The firmware APM running on the embedded processorperforms SPA and SPE management. PAM 512 implements the address map ofthe SPA. It essentially implements an AXI slave interface that is usedby the embedded processor to configure, control, and monitor SPA or suchmodule. FIG. 5B illustrates a block diagram of the PAM 512. In FIG. 5B,the PAM 512 module implements read and write state machines to acceptread/write transactions from APM. It then decodes the transactionaddress and performs requested read or write action to SPA globalregisters or the specified SPE.

SAM 514 provides an AXI master interface for all the SPEs (e.g., 504(0),504(1)) in the SPA (e.g., 500) to access external DRAM (e.g., 410). Allthe SPEs (e.g., 504(0), 504(1)) in an SPA (e.g., 500) have tightlycoupled high performance data and instruction memories. In rarecircumstances, if certain use case needs bigger instruction and/or datamemories than the on-chip memories, SPEs (e.g., 504(0), 504(1)) can usethis interface. SAM 514 performs arbitration of the SPEs (e.g., 504(0),504(1)) inside the SPA (e.g., 500) to provide DRAM (e.g., 410) access.FIG. 5C illustrates a block diagram of the SAM 514. In FIG. 5C, the SAM514 module implements read and write state machines to perform read orwrite operation to the DRAM memory. It accepts the write data from SPEsthrough a Write data FIFO and then deposits that data into the DRAMmemory at specified address. For read requests, it fetches the data fromthe DRAM at the specified address and deposits that data into the readdata FIFO for SPEs to read it from there.

FIG. 5D is a block diagram illustrating details of a SPE slice (e.g.,SPE slice 504(0) or 504(1). FIGS. 5E-5F illustrate memory hierarchy fortwo SPE stages SPE (n) and SPE (n+1) and data sharing between the twoSPE stages SPE (n) and SPE (n+1) connected in chaining fashion.

Each SPE has separate buses for instruction memory or instruction RAM(IRAM) and data memory or DRAM. The data memory or DRAM is divided intothe following five major groups as indicated in Table 7:

TABLE 7 Region Comments Scratch Pad Small variables Input Data Buffer(IDB) Data to be processed Output Data Buffer (ODB) Intermediate orfinal Results Arguments Memory or Arguments from firmware Arguments RAM(ARAM) Miscellaneous Memory or Various buffer status, debug, trace,Miscellaneous RAM (MRAM) etc

An orchestrator or embedded processor 530, which incorporates the APM,can access all the above memories (e.g., IRAM, IDB, ODB, ARAM, MRAM) ifor as needed. In some embodiments, IRAM and/or scratch pad size orlocations are known at the compilation time to the micro-code (in theSPEs). ARAM, MRAM, IDB, ODB, or Off-chip DDR memory are accessed by SPEsas well-known address pointers.

In FIG. 5D and FIG. 5E, the SPE PAM_IF interface 512 is used by theapplication firmware to download SPE micro-code into RAM 518. It is alsoused to access other data memory or DRAM areas such as arguments spaceor ARAM 524, debug registers, and status of the SPE that are accessibleto the firmware. SPE IDB_WRITE (input) feature is used by the ISRAMmodule (508) to load input data into the IDB (e.g., 520) of the firstSPE slice (e.g., 504(0)). This interface on all the SPE slices (exceptthe first one) is connected to the stage before to create a chaining asshown in FIG. 5E, as the IDB 522 of the SPE stage “n+1” is connected tothe SPE stage “n” to create chaining (e.g., as also shown in FIG. 3, as312 (2), . . . , 312(n) is connected to the stage before to createchaining). SPE IDB_Space_Ave (output) feature indicates number of wordsof free space in IDB (e.g., 520, 522). This information is used by thebuffer manager (e.g., buffer manager 406) to deposit data into the IDB(e.g., 520) of the first SPE slice (e.g., 504(0)). It is also used bySPEs (e.g., SPE stage “n” or SPE 504 (0)) to write the intermediateresults using ODB_Write to the next SPE stage (e.g., SPE stage “n+1” orSPE 504(1)). SPE ODB_Space_Ave (input) feature indicates number of wordsof free space available in the IDB (e.g., 524) of the next stage (e.g.,SPE stage “n+1” or SPE 504(1)). It is also used by SPEs (e.g., SPE stage“n” or SPE 504 (0)) to write the intermediate results using ODB_Write tothe next SPE stage (e.g., SPE stage “n+1” or SPE 504(1)). SPE TRIGGER_IN(input) feature is a one clock wide trigger pulse. It is used toincrement TRIGGER_IN_CNT counter. SPE TRIGGER_OUT (output) feature is aone clock wide trigger pulse. It is used to increment TRIGGER_OUT_CNTcounter. SPE_TB (write only) feature points to trace buffer used fordebug of micro-code.

In some embodiments, the SPE micro-code for debug purposes writes debuginformation messages into the trace buffer. Those messages areessentially represented as a series of alpha-numeric characters. Thosealphabets and numbers are then displayed on debug monitor by the APM.

SPE_BUSY feature may indicate to the orchestrator or embedded processorthat the SPE is busy processing data or batch of data. SPE_SOB_OUTfeature generates start of batch pulse to the next SPE in the pipelinethat indicates that the SPE has started processing a batch of data.SPE_EOB_OUT feature generates start of batch pulse to the next SPE inthe pipeline that indicates that the SPE has ended processing a batch ofdata.

All the above mention programmatic features are MRAM based andprogrammatically accessed by micro-code running on the SPE (e.g., SPE504(0) or SPE 504(1)) as pointers. Following table (Table 8) indicatesSPE address map with SPE features.

TABLE 8 offset-32-bit Reg # R/W Name (SPE Feature) Comment 0x00_0000 ROSPE_IRAM Instruction memory 0x00_0000 RW SPE_SP Scratch pad 0x10_0000 RWSPE_IDB Input data buffer 0x20_0000 RW SPE_ODB Output data buffer0x30_0000 RW SPE_ARAM Argument memory 0x40_0000 WO SPE_TB Trace buffer0x40_0008 RO SPE_IDB_DATA_AVE 0x40_0010 RO SPE_ODB_SPACE_AVE Next IDB0x40_0018 RW SPE_ODB_WP Write pointer, updated by SPE microcode. All thedata below WP, upto RP is valid. Data block starting at WP is beingwritten. 0x40_0020 RW SPE_IDB_RP Read pointer, updated by SPE-microcode.All the space below RP, upto WP is free. Data block starting at RP isbeing read. 0x40_0028 RO TRIGGER_IN_CNT Number of external triggersreceived 0x40_0030 RW TRIGGER_OUT_CNT Number of external triggersgenerated 0x40_0038 RW SPE_DONE SPE done status 0x40_0040 RW SPE_BUSYSPE busy status 0x40_0048 RW SPE_BIP_IN Received Batch In Progressstatus 0x40_0050 RW SPE_SOB_OUT Generate SOB pulse to the next SPE0x40_0058 RW SPE_EOB_OUT Generate EOB pulse to the next SPE

As shown in FIG. 5E, the IDB (e.g., 522) of the SPE (e.g., SPE stage“n+1”) is ODB of the previous SPE (e.g., SPE stage “n”) and there areshared buffer (e.g., IDB 522) between neighboring SPEs (e.g., SPE stage“n” and SPE stage “n+1”). During the data sharing between theneighboring SPEs (e.g., SPE stage “n” and SPE stage “n+1”), theprogrammatic status IDB_Data_Ave and ODB_Space_Ave (ODB) are accessedthrough MRAM (e.g., 526, 528), ODB Write commit is provided throughODB_Write_Pointer through MRAM (e.g., 526, 528), IDB Read commit isprovided through IDB_Read_Pointer through MRAM (e.g., 526, 528). In datasharing between the neighboring SPEs (e.g., SPE stage “n” and SPE stage“n+1”), shared buffer (e.g., IDB 522) is optimally used instead oftraditional ping-pong buffers.

FIG. 5F also illustrates that the IDB (e.g., 522) of the SPE (e.g., SPEstage “n+1”) of a current stage is the ODB of the SPE (e.g., SPE stage“n”) of the previous stage and there are shared buffer (e.g., IDB 522)between neighboring SPEs (e.g., SPE stage “n” and SPE stage “n+1”). Thisshared buffer or IDB (e.g., 522) is written by SPE stage “n” using ODBR/W interface and read by the SPE stage “n+1” using IDB R/W interface.In some embodiments, the shared buffer or IDB (e.g., 522) is split intotwo partitions: 1) write region, actively being written by SPE stage“n”, and 2) read region, actively being read by the SPE stage “n+1”. Theboundaries of these two partitions are marked clearly so that the writeand read processes do not conflict with each other. The write partitionis the area of the shared buffer between ODB_Write_Ptr and IDB_Read_Ptr.The read partition is the area of the shared buffer between IDB_Read_Ptrand ODB_Write_Ptr. When new data is written, the SPE stage “n” advancesthe ODB_Write_Ptr to a new value, thereby indicating to the read processthat new data is available for reading. Similarly, when the existingdata is read and processed, the SPE stage “n+1” advances theIDB_Read_Ptr to a new value; thereby indicating to the write processthat new space is available for writing. Such read and write pointerexchanges facilitate smooth flow control between the read and writeprocesses and allow them to exchange arbitrary sized data exchanges.This mechanism avoids overflow and underflow conditions and at the sametime achieves the most optimal usage of the share buffer resourceswithout any wastage or underutilization of the shared buffer memoryresource. In other words, this mechanism enables a high performance, lowresource cost asynchronous data exchanges between two stages of apipelined data processing system.

FIG. 6 is a block diagram illustrating a high level operation of an APM.APM (e.g., APM 602) is a firmware layer that provides a set of servicesfor management and operation of SPA acceleration engines (e.g., SPEs)present in the acceleration storage device. The application controlplane 604 firmware uses these calls to set-up necessary SPAs. Theseservices are also used during run time to configure and monitor activeSPAs as well as to perform various DMA operations that are necessary inan application work flow.

An application intended for acceleration has primarily two components,a) a control plane, and b) a data plane. The control plane runs onembedded processor (606). The data plane runs on one or more SPEs spreadacross one or more SPAs 608. There are primarily two phases of operationfor application control plane 604. First, after application is launchedon the embedded processor 606, it needs to acquire resources needed foracceleration processing and then initialize those resources. Theacceleration resources are provided and managed by the APM 602 (firmwarerunning on the embedded processor 606), hence the application needs APMservices to procure, and initialize the required type and number ofSPAs.

FIG. 7 is a flow chart illustrating a method of SPA initialization.During initialization, at 702, the APM firmware (e.g., APM 602)allocates a free SPA (e.g., 302 as shown in FIG. 3 or 502 of FIG. 5A)with appropriate resources. At 704, the APM deallocates the SPA, if APMreceives such request from ASM. If the deallocation of the SPA is notreceived at APM, at 706, the APM downloads appropriate micro-code intoall the SPEs (e.g., 304(1), 304(2), . . . , 304(n) or 504 (0), 504(1))of the allocated SPA (e.g., 302 or 502). At 708, the APM selects thelast SPE (e.g., 304(n) or 504 (1)) in the allocated SPA (e.g., 302 or502) and configures the OSRAM multiplexor (506). At 710, the APM maytake the allocated SPA (e.g., 302 or 502) out of “reset” if needed.

FIG. 8 is a flow chart illustrating a method of SPA runtime operation.The second part of the application control plane (e.g., 604) deals withrun-time operations. When the application running on the embeddedprocessor is invoked by the host side run-time software such as ASM, theAPM needs to configure the SPAs for data processing, and then triggersthe SPAs to get the acceleration work done.

During run time, when the offloaded application is invoked by the hostsoftware, APM receives relevant parameters related to the function call.More specifically, the device side application receives informationregarding source of the data to be processed, arguments for the call,and destination of the results. At the beginning of the runtimeoperations the APM may extract relevant information for data processing(from the SSD connected to the embedded processor or FPGA) based on theinformation regarding the source of the data received from ASM.

At 802, the APM firmware programs any arguments necessary into theappropriate SPA (e.g., SPA 502) SPEs (e.g., 504(1), 504(1)).

At 804, the APM creates and programs the data movement descriptors. Forexample, the APM writes DMA descriptors to appropriate DMA channels inthe buffer manager (e.g., 406, as shown in FIG. 4A). The DMA descriptorprovides information regarding moving data received from a SSDcontroller into the appropriate SPA input buffers called as ISRAM (e.g.,508). APM also programs another DMA channel to move the SPA (e.g., SPAprocessing results from OSRAM (e.g., 318 of FIG. 3) memory to externalbuffers.

At 806, the APM enable the SPEs (e.g., 504(1), 504(1)) in the SPA (e.g.,SPA 502). For example, once the DMAs (e.g., 206 of FIG. 2B) areprogrammed, the APM takes the SPEs (e.g., 304(1), 304(2), . . . ,304(n)) out of reset. At that point SPEs (e.g., 304(1), 304(2), . . . ,304(n)) start processing the requested data and produce intendedresults. For example, the first SPE (e.g., SPE 304(1)) in the SPA (e.g.,spa 302) selected for processing, keeps monitoring arrival of inputdata. Once sufficient input data is detected in the input data buffer(IDB) (e.g., 312(1)), the first SPE (e.g., 304(1)) starts processing. Itreads the data from IDB (e.g., 312(1)), processes it and then writesappropriate intermediate results into the IDB ((e.g., 312(2)) of thenext stage (e.g., 304(2). Once a batch of data is completely processedby the first SPE (e.g., SPE 304(1)), it sends a trigger to the secondSPE (e.g., 304(2)). At that point the second SPE (e.g., 304(2)) startsprocessing data in its IDB (e.g., 312(2)). And the process follows withsubsequent SPEs (e.g., 304(3), . . . , 304(n)).

At 808, the APM determines if all the requested data is processed by aSPE. When all the requested data is processed by a SPE (e.g., 304(1)),the micro-code sets the “done” status. The APM monitors all the SPEs(e.g., 304(1), 304(2), . . . , 304(n)) for completion of the processing.

At 810, once the processing is finished by all the SPEs (e.g., 304(1),304(2), . . . , 304(n)), the APM return the DONE status to theapplication control plane which in turn sends the results back to thehost side application component.

At 812, once the results are available and moved out of the SPA (e.g.,302), the APM resets or disables the SPA (e.g., 302).

The following table (Table 9) illustrates an APM application programminginterface (APIs) that are currently identified.

TABLE 9 Return Value API Name ARG Type ARG Name apm_status_t apm_initvoid apm_status_t apm_spa_alloc u32 spe_count_needed u32 *spa_idapm_status_t apm_spa_dealloc u32 spa_id apm_status_tapm_spa_spe_opcode_download u32 spa_id u32 spe_id char *file_nameapm_status_t apm_spa_spe_last u32 spa_id u32 spe_id apm_status_tapm_spa_spe_aram_write u32 spa_id u32 spe_id u32 Offset u8 *buff u32buff_size apm_status_t apm_spa_spe_aram_read u32 spa_id u32 spe_id u32Offset u8 *buff u32 buff_size apm_status_t apm_spa_set_reset_mask u32spa_id u64 spe_reset_mask apm_status_t apm_spa_check_done u32 spa_id u64done_bit_mask apm_status_t apm_spa_load_input_data u32 spa_id u32data_buff_addr u32 Length apm_status_t apm_spa_get_output_data u32spa_id u8 *buffer u32 Len apm_status_t apm_spa_get_tb_bit_mask u32spa_id u64 *tb_bit_mask apm_status_t apm_spa_reg_dump void apm_status_tapm_spa_spe_opcode_dump u32 spa_id u32 spe_id apm_status_tapm_spa_spe_data_dump u32 spa_id u32 spe_id apm_status_tapm_spa_spe_read_tb u32 spa_id u32 spe_id apm_status_tapm_spa_config_read u32 spa_id u32 Offset U64 *value u32 sizeapm_status_t apm_spa_config_write u32 spa_id u32 Offset void *buf u32size apm_move_data apm_sd_start apm_sd_done

The API “apm_init” initializes the APM, the API “apm_spa_alloc”allocates available SPA, the API “apm_spa_dealloc” deallocates a SPA,the API “apm_spa_spe_opcode_download” downloads application micro-codeopcode file to a SPE IRAM, the API “apm_spa_spe_last” sets the last SPEof a SPA, the API “apm_spa_spe_aram_write” writes application argumentsto a SPE ARAM, the API “apm_spa_spe_aram_read” reads data from a SPEARAM, the API “apm_spa_set_reset_mask” turns on one or more SPE(s) of aSPA, the API “apm_spa_check_done” checks if all SPEs of a SPA are done,the API “apm_spa_Ioad_input_data” loads input block of data fromexternal memory to SPA ISRAM data buffer by programming buffer managerDMA, the API “apm_spa_get_output_data” gets output data from SPA outputdata buffer (OSRAM) to the specified external memory location, the API“apm_spa_get_tb_bit_mask” gets trace buffer bit mask of a SPA, the API“apm_spa_reg_dump” prints SPA registers, the API“apm_spa_spe_opcode_dump” dumps SPE opcode, the API“apm_spa_spe_data_dump” dumps SPE data, the API “apm_spa_spe_read_tb”reads SPE trace buffer, the API “apm_spa_config_read” reads value from aSPA configuration register, the API “apm_spa_config_write” writes valueto a SPA configuration register.

In application data plane, each SPE slice (e.g., 504(0), 504(1)) isprogrammed with the application specific micro-code that performs one ormore specific data processing or manipulation functions needed for thatapplication. The micro-code on the SPEs (e.g., SPE stage “n+1”) waitsfor the arrival of the input data or intermediate results from theearlier processing stage (e.g., SPE stage “n”). Before processing theinput data or results of the earlier stage (e.g., SPE stage “n”),micro-code makes sure that there is enough space in the output databuffer which is nothing but the input data buffer of the subsequentstage. Once these two conditions are fulfilled, it starts the mainprocessing function. The micro-code operates within the bounds of SPEaddress map (Table 10). The addresses and data structures used by SPEmicro-code base structure are described below. The following datastructure pointers are well-known from SPE address map.

For example, “IDB_ptr” is a pointer to the data buffer to be processed,“ODB_ptr” is the pointer to the data buffer where results to bedeposited, “ARG_ptr” is the pointer to the arguments block if needed,“IDB_Data_Ave_ptr” is a register containing number of words of dataavailable, and “ODB_Space_Ave_ptr” is a register containing number ofwords of space available for results.

SPE (e.g., SPE stage “n”) micro-code accesses data from IDB (e.g., 520)and ODB (e.g., 522) buffers. Every SPA (e.g., 502) has two stagingmemories (e.g., ISRAM 508 and OSRAM 510) that move data in and out ofthe SPA (502). Buffer manager (e.g., 406) is in charge of moving databetween SPAs (e.g., 404(1), . . . , 404(n)) and DRAM (e.g., 410). Buffermanager (e.g., 406) performs data movements using a set of DMAdescriptors. Each DMA descriptor essentially provides a tuple consistingof source address, destination address, length, and certain flags. APM(e.g., 602) firmware (running on the embedded processor) programs thenecessary DMA descriptors to buffer manager (e.g., 406) as needed. APM(e.g., 602) constructs the appropriate DMA descriptors based on thearguments received from the applications for data movements. APMprovides two APIs to the applications for the purpose of the datamovements to/from SPA (e.g., 404(1), . . . , 404(n)) and DRAM (e.g.,410).

FIG. 9 illustrates a graph illustrating how the performance, power,area, cost, etc. are when processing data using the SPE architecture(e.g., FIG. 5A) with respect to processing data at host CPU or at thehardware level. The data processing performed using normal CPU providesbetter flexibility and ease of debug and development, althoughperformance, power, and area may not be the best. On the other end ofthe spectrum, a hardware based data processing may provide betterperformance, power, and area, however it may lack the flexibility, andease of debug and development. Hence the proposed SPE architectureattempts to provide a balance between these two extremes and attempts toachieve best of both the worlds. That is to say that the SPEarchitecture combines advantages of CPU such as flexibility and ease ofdevelopment with the benefits of the hardware such as performance andpower.

It will be understood that, although the terms “first”, “second”,“third”, etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondiscussed herein could be termed a second element, component, region,layer or section, without departing from the spirit and scope of theinventive concept.

Spatially relative terms, such as “beneath”, “below”, “lower”, “under”,“above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that such spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly. In addition, it will also be understood thatwhen a layer is referred to as being “between” two layers, it can be theonly layer between the two layers, or one or more intervening layers mayalso be present.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the inventiveconcept. As used herein, the terms “substantially,” “about,” and similarterms are used as terms of approximation and not as terms of degree, andare intended to account for the inherent deviations in measured orcalculated values that would be recognized by those of ordinary skill inthe art.

As used herein, the singular forms “a” and “an” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising”, when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. Expressions such as “at least one of,” when preceding alist of elements, modify the entire list of elements and do not modifythe individual elements of the list. Further, the use of “may” whendescribing embodiments of the inventive concept refers to “one or moreembodiments of the present invention”. Also, the term “exemplary” isintended to refer to an example or illustration. As used herein, theterms “use,” “using,” and “used” may be considered synonymous with theterms “utilize,” “utilizing,” and “utilized,” respectively.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, “coupled to”, or “adjacent to” anotherelement or layer, it may be directly on, connected to, coupled to, oradjacent to the other element or layer, or one or more interveningelements or layers may be present. In contrast, when an element or layeris referred to as being “directly on”, “directly connected to”,“directly coupled to”, or “immediately adjacent to” another element orlayer, there are no intervening elements or layers present.

Any numerical range recited herein is intended to include all sub-rangesof the same numerical precision subsumed within the recited range. Forexample, a range of “1.0 to 10.0” is intended to include all subrangesbetween (and including) the recited minimum value of 1.0 and the recitedmaximum value of 10.0, that is, having a minimum value equal to orgreater than 1.0 and a maximum value equal to or less than 10.0, suchas, for example, 2.4 to 7.6. Any maximum numerical limitation recitedherein is intended to include all lower numerical limitations subsumedtherein and any minimum numerical limitation recited in thisspecification is intended to include all higher numerical limitationssubsumed therein.

The electronic or electric devices and/or any other relevant devices orcomponents according to embodiments of the present invention describedherein may be implemented utilizing any suitable hardware, firmware(e.g. an application-specific integrated circuit), software, or acombination of software, firmware, and hardware. For example, thevarious components of these devices may be formed on one integratedcircuit (IC) chip or on separate IC chips. Further, the variouscomponents of these devices may be implemented on a flexible printedcircuit film, a tape carrier package (TCP), a printed circuit board(PCB), or formed on one substrate. Further, the various components ofthese devices may be a process or thread, running on one or moreprocessors, in one or more computing devices, executing computer programinstructions and interacting with other system components for performingthe various functionalities described herein. The computer programinstructions are stored in a memory which may be implemented in acomputing device using a standard memory device, such as, for example, arandom access memory (RAM). The computer program instructions may alsobe stored in other non-transitory computer readable media such as, forexample, a CD-ROM, flash drive, or the like. Also, a person of skill inthe art should recognize that the functionality of various computingdevices may be combined or integrated into a single computing device, orthe functionality of a particular computing device may be distributedacross one or more other computing devices without departing from thespirit and scope of the exemplary embodiments of the present invention.

Although exemplary embodiments of system and method for accelerated dataprocessing in SSDs have been specifically described and illustratedherein, many modifications and variations will be apparent to thoseskilled in the art. Accordingly, it is to be understood that system andmethod for accelerated data processing in SSDs constructed according toprinciples of this invention may be embodied other than as specificallydescribed herein. The invention is also defined in the following claims,and equivalents thereof.

What is claimed is:
 1. A system comprising: one or more storageprocessing accelerators (SPAs), an SPA of the one or more SPAscomprising programmable processors coupled together in a pipeline; andan acceleration platform manager (APM) connected to the one or more SPAsand the programmable processors, and configured to control dataprocessing in the one or more SPAs and the programmable processors. 2.The system of claim 1, wherein the programmable processors comprise oneor more storage processing engines (SPEs), wherein an SPE of the one ormore SPEs is configured to provide an output of the SPE to a next SPE inthe pipeline to be used as an input of the next SPE, and wherein the APMis configured to: receive application function processing informationfrom an application service manager (ASM) and allocate the SPA from theone or more SPAs; download a micro-code into the SPE of the one or moreSPEs in the SPA; extract data based on the application functionprocessing information; program one or more arguments received from theASM in the SPE of the one or more SPEs in the SPA; create and programone or more data movement descriptors; enable the one or more SPEs inthe SPA, wherein once enabled, the SPE of the one or more SPEs in theSPA is configured to process data based on the application functionprocessing information; determine if the data processing is completed bythe SPE of the one or more SPEs in the SPA; and send, based ondetermining that the data processing is completed by the SPE of the oneor more SPEs in the SPA, a result of the data processing by the SPEs ofthe SPA, to the ASM.
 3. The system of claim 2, further comprising a hostprocessor configured to: intercept an application function call; gatherthe application function processing information comprising one or moreof source of data for processing the application function call, type ofprocessing of the application function call, arguments for theapplication function call, and destination of the result after the datais processed; and receive in a host device software stack, theapplication function processing information, wherein based on receivingthe application function processing information, the ASM in the hostprocessor is configured to: select a processor comprising the APM forapplication function processing; schedule the data processing in theprocessor; initiate data transfer direct memory access (DMA) engines toload appropriate data into one or more buffers of the processor; andsend an invocation trigger and the application function processinginformation to the processor.
 4. The system of claim 2, wherein the SPAof the one or more SPAs comprises an input buffer or an input stagingrandom-access memory (ISRAM) and an output buffer or an output stagingRAM (OSRAM), wherein the system further comprises a multiplexerconfigured to multiplex outputs of the one or more SPEs in the SPA intothe OSRAM of the SPA.
 5. The system of claim 2, wherein the SPEcomprises an input data buffer (IDB), wherein the SPE is configured towrite an output of the SPE into the IDB of the next SPE of the one ormore SPEs in the pipeline.
 6. The system of claim 5, wherein the IDB isshared between two neighboring SPEs of the one or more SPEs.
 7. Thesystem of claim 5, wherein the micro-code running on the SPE of the oneor more SPEs is configured to programmatically generate start of batchand end-of-batch indications to the next SPE of the one or more SPEs inthe pipeline for batch oriented pipelined data processing.
 8. The systemof claim 5, further comprising one or more solid state drives (SSDs)connected to a processor comprising the APM, wherein the APM isconfigured to extract data from the one or more SSDs to be processed bythe one or more SPEs.
 9. The system of claim 8, wherein the APM isconfigured to extract data from the one or more SSDs to be processed bythe SPEs.
 10. The system of claim 2, wherein the APM is furtherconfigured to access one or more of instruction RAM (IRAM) and data RAM(DRAM) via the SPE of the one or more SPEs.
 11. The system of claim 10,wherein the SPE comprises a first bus for the IRAM and a second bus forthe DRAM.
 12. The system of claim 11, wherein the DRAM comprises scratchpad, input data buffer (IDB), output data buffer (ODB), argument RAM(ARAM), and miscellaneous RAM (MRAM), wherein one or more programmaticSPE features are configured to be based on the MRAM and programmaticallyaccessed by micro-code running on the SPE as pointers.
 13. The system ofclaim 1, wherein the one or more SPAs are configured to run in parallelon different slices of data received at the APM.
 14. A systemcomprising: one or more storage processing accelerators (SPAs), an SPAof the one or more SPAs comprising programmable processors coupledtogether in a pipeline; and a processor connected to the one or moreSPAs and the programmable processors, and configured to control dataprocessing in the one or more SPAs and the programmable processors. 15.The system of claim 14, wherein the programmable processors comprise oneor more storage processing engines (SPEs), wherein an SPE of the one ormore SPEs is configured to provide an output of the SPE to a next SPE inthe pipeline to be used as an input of the next SPE, and wherein theprocessor comprises an acceleration platform manager (APM) configuredto: receive application function processing information from anapplication service manager (ASM) and allocate the SPA from the one ormore SPAs; download a micro-code into the SPE of the one or more SPEs inthe SPA; extract data based on the application function processinginformation; program one or more arguments received from the ASM in theSPE of the one or more SPEs in the SPA; create and program one or moredata movement descriptors; enable the one or more SPEs in the SPA,wherein once enabled, the SPE of the one or more SPEs in the SPA isconfigured to process data based on the application function processinginformation; determine if the data processing is completed by the SPE ofthe one or more SPEs in the SPA; and send, based on determining that thedata processing is completed by the SPE of the one or more SPEs in theSPA, a result of the data processing by the SPEs of the SPA, to the ASM.16. The system of claim 15, wherein the SPA of the one or more SPAscomprises an input buffer or an input staging random-access memory(ISRAM) and an output buffer or an output staging RAM (OSRAM), andwherein the SPE comprises an input data buffer (IDB), and wherein theSPE is configured to write an output of the SPE into the IDB of the nextSPE of the one or more SPEs in the pipeline.
 17. The system of claim 16,further comprising one or more solid state drives (SSDs) connected tothe processor comprising the APM, wherein the APM is configured toextract data from the one or more SSDs to be processed by the one ormore SPEs.
 18. The system of claim 15, wherein the APM is furtherconfigured to access one or more of instruction RAM (IRAM) and data RAM(DRAM) via the SPE, wherein the SPE comprises a first bus for RAM and asecond bus for DRAM, wherein the DRAM comprises scratch pad, input databuffer (IDB), output data buffer (ODB), argument RAM (ARAM), andmiscellaneous RAM (MRAM), wherein one or more programmatic SPE featuresare configured to be based on the MRAM and programmatically accessed bythe micro-code running on the SPE as pointers.
 19. A device comprising:programmable processors arranged in clusters, a cluster comprising twoor more programmable processors coupled together in a pipeline, whereinthe cluster is a storage processing accelerator (SPA), wherein aprogrammable processor of the two or more programmable processors isconfigured to provide an output of the programmable processor to a nextprogrammable processor in the pipeline to be used as an input of thenext programmable processor; and a processor connected to the clustersand the two or more programmable processors, and configured to controldata processing in the clusters and the two or more programmableprocessors.
 20. The device of claim 19, further comprising one or moresolid state drives (SSDs) connected to the processor comprising anacceleration platform manager (APM), wherein the two or moreprogrammable processors comprise two or more storage processing engines(SPEs), and wherein the APM is configured to extract data from the oneor more SSDs to be processed by the SPEs.